EE6007 MICRO ELECTRO MECHANICAL SYSTEMS


Important Questions
Prepared by
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Unit 1
1.silicon based MEMS Processor
2.stress and strain analysis(problems also), flexural beam bending ,torsional deflection.
Unit 2 
1.thermal couples(ink jet printer too),thermal autuator
2.magnetic actuators- micromagnetic components
3.parallel plate capacitors
Unit 3
1. Stress on flexual centilevers
2.piezoelectric effects- piezoelectric materials- application to inertia pressure, tactile and flow sensors
Unit 4
1.LIGA process
2.Plasma etching,wet ethching
3.DRIE (rare)
Unit 5 
1.optical MEMS and its apps
2.PDMS- PMMA- parylene fluorocarbon


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SYLLABUS
UNIT-1: INTRODUCTION Intrinsic characteristics of MEMS- Energy domains and transducers- sensors and actuators- Introduction to micro fabrication- silicon based MEMS Processor- new materials- review of Electrical and mechanical concepts in MEMS- Semiconductor devices- stress and strain analysis- flexural beam bending - torsional deflection. UNIT-2: SENSORS AND ACTUATOR-1 Electrostatic sensors - parallel plate capacitors- Application- Interdigitated Finger capacitor-Comb drive devices- micro grippers- micro motors- thermal sensing and actuation- thermal expansion- thermal couples- thermal resistors- thermal bimorph- applications- magnetic actuators- micromagnetic components- case studies of mems in magnetic actuators- actuation using shape memory alloys. UNIT-3: SENSORS AND ACTUATORS- 2 piezoresistive sensors- piezoresistive sensor materials- stress analysis of mechanical elements- application of Inertia, pressure, tactile and flow sensors - piezoelectric sensors and actuators- piezoelectric effects- piezoelectric materials- application to inertia , acoustics, tactile and flow sensors UNIT-4: Micromachining Silicon anisotropic etching- anisotropic wet etching- dry etching of silicon- plasma etching- deep reaction ion etching (DRIE)- Isotropic wet etching- gas phase etchants- case studies- basic surface micro machining process- structural and sacrificial materials- acceleration of sacrificial etch- striction and antistriction methods- LIGA process - assembly of 3D MEMS- foundry process. UNIT-5: POLYMER AND OPTICAL MEMS polymers in MEMS- polimide - (SU-8)- liquid crystal polymer (LCP)- PDMS- PMMA- parylene fluorocarbon - application to acceleration, pressure, flow and tactile sensors- optical MEMS-
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